Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions
(Proceedings / [Electrochemical Society] ; v. 93-29)
| データ種別 | 図書 |
|---|---|
| 著者標目 | *International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (2nd : 1993 : Hawaii) Schmidt, Martin A. Electrochemical Society. Electronics Division Electrochemical Society. Dielectric Science and Technology Division |
| 出版情報 | Pennington, NJ : Electrochemical Society , c1993 |
書誌詳細を非表示
| 巻次 | ISBN:1566770688 |
|---|---|
| 大きさ | x, 485 p. : ill. ; 23 cm |
| 本文言語 | 英語 |
| 一般注記 | Symposium held at Hawaii, May 16-21, 1993 Includes bibliographical references and indexes |
| 書誌ID | 1000162745 |
| ISBN | 1566770688 |
| NCID | BA22331898 |

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