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Advanced Materials for Thermal Management of Electronic Packaging / by Xingcun Colin Tong
(Springer Series in Advanced Microelectronics ; 30)
| データ種別 | 電子ブック |
|---|---|
| 著者標目 | *Tong, Xingcun Colin SpringerLink (Online service) |
| 出版情報 | New York, NY : Springer Springer Science+Business Media, LLC , 2011 |
書誌詳細を非表示
| 版 | 1 |
|---|---|
| 巻次 | ISBN:9781441977595 |
| 大きさ | v.: digital |
| 本文言語 | 英語 |
| 件 名 | LCSH:Physics LCSH:Engineering LCSH:Electronics LCSH:Optical materials FREE:Physics FREE:Electronic Circuits and Devices FREE:Optical and Electronic Materials FREE:Engineering Thermodynamics, Heat and Mass Transfer FREE:Electronics and Microelectronics, Instrumentation |
| 書誌ID | OB00003749 |
| ISBN | 9781441977595 |
| NCID | LB40006651 |